September 2024 - Present
The BYU Hypersonics Lab is actively working on a project from the University Consortium of Applied Hypersonics in conjunction with the Joint Hypersonics Transition Office.
In my work, I am exploring different surrogate modeling techniques of high-fidelity hypersonic CFD data of the Orion Reentry Vehicle. The Orion is simulated ranging from Mach 10 to Mach 30 and at varying angles of attack. Hypersonic CFD is very difficult with highly complex physics to be captured. Once a successful simulation is converged, this data can be used to trian surrogate models.
Traditional surrogate modeling techniques use dimensionality reduction to tranform high dimensional data (like CFD with millions of degrees of freedom at times) into a simpler latent representation with only tens of degrees of freedom. There are many techniques to reduced the dimensionality. In my work, I am employing machine learning methods to reduce the CFD data by using a Convolutional Autoencoder. This technique leverages the powerful nonlinear capabilities of deep learning methods and allows it to be utilized with traditional surrogate modeling techniques that have been used for decades.
May 2023 - August 2024
In the TRL I worked as an undergraduate research assistant helping to develop high-fidelity CFD simulations of centrifugal compressors in STAR-CCM+. I developed complex compressor CFD meshes and ran multi-million cell simulations on the university super computing clusters. I helped analyze the results of the simulations using post processing techniques. The research ultimately led to a new model for predicting compressor performance and design. See our conference paper here, titled Extracting Meanline Modeling Parameters for Radial Turbomachinery From CFD.
June 2023 - December 2023
In the SMASH Lab, we worked with Sandia National Laboratories to research different electronics encapsulation techniques to protect against high shock environments. This research has application in high impact devices, such as projectiles, which contain sensitive electronics that need to withstand the impact for data transmission or recording. My work involved manufacturing test capsule adapters as well as exploring microbead vibration and compression techniques. Our work ultimately lead to a journal article in the Journal of Electronic Packaging. The paper, titled Microbead Encapsulation for Protection of Electronic Components, can be found here.